Solar Encapsulant Film Fon-10025
Product Features

Good stability, can effectively, improve and deal with die cutting and bonding.

The high adhesion adhesive provides excellent adhesion to avariety of surfaces.

Good resistance to temperature, thermal conductivity, insulation properties.

used for bonding and heat dissipation of LED strips,electronic components and other components.
product material
TECHNICAL Parameters
|
Brand |
Fonitaniya™ |
|
Serial Number |
Fon-10025 |
|
Type |
Thermoset |
|
Thickness (Uncured) |
18 mil (0.46 mm) |
|
Density (Uncured) |
0.88 g/cm³ |
|
Tensile Strength (Cured) |
9.1 MPa |
|
Elongation (Cured) |
>1000% |
|
Adhesion to Glass |
>100 N/cm |
|
Water Absorption (Cured) |
<0.01% |
|
Electrical Volume Resistivity (Cured) |
1.0 × 10^14 Ω·cm |
|
Optical Transmittance (Cured) |
91% |
|
UV Cutoff (Cured) |
310 nm |
|
MVTR |
5.7 g/m²·day |
|
Continuous Service Temperature |
>90°C |
|
Shelf Life |
6 months |
Overview
The Solar Encapsulant Film Fon-10025 is a premium encapsulant solution for photovoltaic (PV) modules, combining high optical clarity with exceptional resistance to moisture, UV radiation, and thermal stress. Its rapid curing ability supports efficient manufacturing processes, while its advanced thermoset material composition ensures longevity and reliability. By reducing moisture-related degradation and enhancing light transmission, Fon-10025 contributes to optimal solar panel performance and energy output.
01
7 Jan 2019
Protects solar cells from environmental stress during lamination.
01
7 Jan 2019
Promotes high energy conversion efficiency in PV modules.
01
7 Jan 2019
Enhances durability and structural integrity of solar panels.

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